The VIA Eden 1.0 GHz processor with the VIA CX700 M Chipset provides a highly sophisticated power efficient architecture into a compact package with a maximum power envelope of just 3.5 watts.
Low power consumption and high integration make Global American's 3302030 the ideal solution for industrial embedded applications.
VIA's CX700M Chipset features the VIA UniChrome™ Pro II Integrated Graphics Processor (IGP) ensuring optimal performance for all multimedia, entertainment, and productivity applications.
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